Sell Additive HY-CS For Cu-Sn Alloy Plating

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Additive HY-CS For Cu-Sn Alloy Plating

Specific Properties & Application
1. The deposit has fine grain structure and high adhesion strength.
2. The bath is easy to maintain due to its high stability.
Bath Composition & Operating Condition
Cubric Sulfate 60 ~ 80 g/L
Sulfuric acid (20%) 20 ~ 30 ml/L
HY-CS stabilizer 40 ~ 60 ml/L
Temp. 15 ~ 250C
Time 3 ~ 10 s'

Note: this specification is based on our company expirement and informations for reference only.
Brand Name
Supply Capacity
10mt per month
Condition of Goods
Lead Time from Order to Shipment
14 days
Minimum Order Quantity
25 kgs
Terms of Payment
L/C at sight
Terms of Sale
FOB Shang Hai