You May Also Be Interested In:
The PCB category contains many influential factors on the overall solder joint reliability including: pad metallurgy, board thickness, pad size, base material, via formation
technology, routing method (via in pad versus fan out) , PCB layer count, soldermask technology, and pad definition versus mask definition. The components sub-group
parameters that influences the assembly reliability may include; construction (flex versus rigid carrier etc. ) , die size to package ratio, solderball size, attachment pad size and
definition, base materials, package size, and ball configuration.