diamond grinding wheel for semiconductor industry
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diamond grinding wheel
* Silicon wafer back grinding wheel
With carefully-selected diamond grits and bonding matrix, the Silicon Wafer Back Grinding Wheel of SAIMENGDIAMOND has achieved superior quality of silicon wafer back.
Especially, a variety of pores formed through our creative process making it possible to have grinding damage minimized, which could occur in grinding work.
* Silicon wafer edge grinding wheel
It is a kind of wheel designed to use for precision process of wafer edges, after silicon ingot gets sliced with a certain thickness using wire or ID blade, to be R, T & R or T-shaped as well as to have diameter of wafers fit to size for following process, and There are two types, such as Metallic and Electroplated type for these wheels.